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the Factors of Affecting Thermal Resistance


Thermal resistance is the obstruction effect of an object on heat conduction. The unit of thermal resistance is C/W, that is, the temperature difference between the two ends of the thermal conduction path when the continuous heat transfer power of the object is 1W. The thermal resistance of LED refers to the thermal resistance Rth of LED, which is the temperature difference between PN node and on-line support or heat dissipation substrate when the heat conduction is stable after the LED is lit. Thermal resistance value is usually expressed by theta or R, where Tj is the temperature at the junction, Tx is the temperature at which heat is transferred to a certain point, and P is the heating power imported. High thermal resistance means that heat is not easy to transfer, so the temperature produced by the package is higher than that produced by the package. Thermal resistance can be used to judge and predict the heating status of the package. The lower the temperature/W value, the faster the heat transfer from the chip to the outside world. Therefore, reducing the temperature of PN junction in the chip is beneficial to prolong the lifetime of LED.

So what are the main factors affecting the thermal resistance of LED components? How to reduce the thermal resistance of LED components?

1. The structure of LED chips and raw materials are also one of the factors affecting the thermal resistance of LED. Reducing the thermal resistance of LED itself is the precondition.

2. Heat sink materials with different thermal conductivity, such as copper and aluminium, also have a great influence on the thermal resistance of LED. Therefore, choosing suitable heat sink materials is also one of the ways to reduce the thermal resistance of LED components.

3. Even if the same heat sink material is used, it is directly related to the size of the heat sink area. Good secondary heat dissipation design and large area will correspondingly reduce the thermal resistance, which has a great effect on the luminous efficiency and life extension of the LED.

4. The thermal resistance of LED chips will be affected by the thermal conductive glue or directly connected with metal, including different kinds of thermal conductive glue and metal materials. It is necessary to minimize the thermal resistance between the LED and the load interface of the secondary cooling mechanism.

5. Excessive ambient temperature of the LED module will also affect the thermal resistance of the LED module and reduce the ambient temperature as much as possible.

6. Select certain materials and control the rated input power and other technical details, in order to improve the luminous efficiency and prolong the life of the LED as the premise, deal with the heat dissipation problem of the LED.

To sum up, we must consider the following points in the design of LED:

1. Reduce the thermal resistance of the chip.

2. Optimizing the heat channel.

(a) Channel architecture: the shorter the length (L), the better the area (S), the fewer the links, and the better the heat conduction bottleneck on the channel.

B. The greater the thermal conductivity of channel material, the better.

C. Improve the encapsulation process to make the interface contacts between channel links more close and reliable.

3. Strengthen the conduction/heat dissipation function of the telecommunication channel.

4. Optical channel materials with higher conductivity/heat dissipation efficiency are selected.

Yiwu Fuwei e-commerce firm (IACS Co., Limited) is a very professional Led manufacturer who produces high quality outdoor led light. Our popular products are solar led lights, UFO lights, underwater lights and so on. If you have any question about the led product, please feel free to contact us.